New Model Silicon Wafer Bake and Adhesive Curing Machine with Programmable Intelligent Temperature Control, Heated Hot Plate, and Liftable Ejector Pins
Silicon Wafer Bake and Adhesive Curing Machine
WEVIO Silicon Wafer Bake and Adhesive Curing Machine
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Products DETAILS
New Model Silicon Wafer Bake and Adhesive Curing Machine with Programmable Intelligent Temperature Control, Heated Hot Plate, and Liftable Ejector Pins
Wide Range of Applications
Suitable for conveying, model making, packaging, and other industries.












